SiCarrier has announced plans to produce ASML-compatible lithography machines by 2026, alongside ongoing collaborations and expansion efforts in research and development. The company has secured key partnerships with major foundries and is establishing a broader international presence. SiCarrier’s recent patents signify groundbreaking advancements in semiconductor technology.
SiCarrier, a prominent Chinese chip equipment manufacturer, has recently revealed its ambitious product roadmap during SEMICON China. The firm has developed lithography machines tailored for 300-mm wafers utilizing 28nm processes, with plans to release an enhanced version that aligns with ASML and Applied Materials by 2026, as reported by Anue.
Market Director Zhao Min highlighted that SiCarrier is committed to ensuring complete compatibility of its equipment with that of domestic fabs. Furthermore, Chief Technology Officer Chen Dong announced partnerships with multiple fabs to establish joint laboratories, with expectations to disclose its initial batch of commercial orders by the fourth quarter of 2025.
Notably, SiCarrier has secured contracts with major Chinese foundries, such as SMIC and Hua Hong Group, and already has etching equipment functioning within power semiconductor production lines. The company is also expanding its research and development centers to more than ten cities over the next three years while establishing service centers in Europe and Southeast Asia.
Founded in 2022, SiCarrier has garnered a prestigious reputation in the semiconductor industry. Technology Chief Dai Jun is recognized for his supervisory role at China’s Big Fund II and his association with SMIC. Additionally, reports indicate that SiCarrier may be a state-sponsored semiconductor equipment developer actively collaborating with Huawei.
SiCarrier made headlines for securing a patent in 2023 for 5nm chips utilizing DUV tools, which is reportedly connected to Huawei’s 7nm chip featured in the Mate 60 Pro. At SEMICON China, the company impressed attendees with a diverse range of semiconductor manufacturing equipment, including metrology and inspection systems, while details regarding lithography tools remained undisclosed. Nevertheless, according to Tom’s Hardware, SiCarrier possesses lithography machines that can process 300-mm wafers at 28nm and older nodes, alongside a comprehensive collection of tools covering every stage of front-end semiconductor production.
In summary, SiCarrier is poised to significantly impact the semiconductor industry with its roadmap that includes ASML-compatible lithography machines by 2026. With strategic partnerships and ongoing expansion in both R&D and service capabilities, the company is well-positioned to enhance its offerings in the domestic and international semiconductor markets. Given its recent achievements, including a breakthrough in chip fabrication technology, SiCarrier’s growth trajectory appears promising.
Original Source: www.trendforce.com
